Intel: 14A defect density curve best since 22nm, risk production in H2 2027

Summary

Intel CFO David Zinsner said at a Deutsche Bank tech conference that the upcoming Intel 14A process has the best defect density curve since the 22nm node. 14A will use second-generation RibbonFET transistors, PowerDirect backside power, and ASML High-NA EUV lithography, with risk production planned for H2 2027 and volume production in 2028. Intel is also advancing EMIB-T advanced packaging, with Broadcom, Meta, and Google evaluating or adopting the technology.