Hejian Gongruan Releases China's First 3D Chip Physical Design Tool: Fully Adapted to Tao's Law, Filling Domestic EDA Gap, Tailored for Advanced Domestic Process Nodes
Bubble signal: 0 · NeutralRelevance 30Chips & ComputeChina
Source: IT Home · Published 2026-09-02
Summary
At the 2026 IDAS summit, Hejian Gongruan released UniVista 3DIC Designer, China's first 3D chip physical design tool, aiming to fill the gap in domestic EDA for commercial-grade 3DIC physical design. Tailored for advanced domestic process nodes, the tool supports cutting-edge architectures like logic folding and hybrid bonding, providing an autonomous and controllable 3D design foundation for AI and other computing chips.
Bubble analysis
This news does not directly address the AI investment bubble, but it reflects China's efforts to localize EDA tools for AI chip design, which could affect future AI chip supply and costs, indirectly relating to AI investment.
#china#chip-design#3dic#eda
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