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Arm Releases New Compute Subsystem Neoverse CSS N4 for Cloud and Data Centers

At the Arm Everywhere China annual conference, Arm released the Neoverse CSS N4, a new compute subsystem for cloud and data centers. Targeting agentic infrastructure, it offers high configurability, supports 3.8 GHz CPU frequency, LPDDR6 memory, and PCIe Gen 7, based on a 3nm process with up to 128 cores per die. Compared to the previous generation, performance improvements are significant. Hongjun Microelectronics is among the first partners to adopt the technology.

IT Home2026-09-08Chips & ComputeGlobalrel 35Read original ↗

In Less Than Two and a Half Years: Intel Surpasses One Million High-NA EUV Wafers, Exceeding All Other Manufacturers Combined

Intel announced that it has processed over one million 300mm wafers using High-NA EUV lithography equipment, a milestone reached in less than two and a half years since its first tool was assembled. According to ASML, global High-NA EUV systems have processed over 500,000 wafers in total, with Intel alone exceeding the combined output of all other users. The technology is already used in production of Panther Lake processors, but faces reticle size limitations, prompting Intel to push for a larger 6x12 inch reticle standard.

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Arm Releases Second-Generation Mobile Compute Subsystem CSS for Mobile 2 with Dual SME2 Engines and Neural Acceleration GPU

At the Arm Everywhere China event in Shanghai, Arm released the second-generation mobile compute subsystem CSS for Mobile 2, a computing platform for agentic AI and AI-native graphics, integrating the C2 CPU cluster, Mali G2-Ultra NX GPU, and system interconnect. The platform features dual SME2 engines in the CPU for significant performance gains and embeds a neural accelerator into the GPU shader cores to support neural graphics workloads.

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CXMT Announces LPDDR6 Mass Production, Debuting in Xiaomi 18 Fold

CXMT announced that its self-developed LPDDR6 chip has entered mass production and commercial use, debuting in the Xiaomi 18 Fold foldable flagship phone, marking the first global commercial deployment of LPDDR6 in a flagship phone. The chip supports a maximum transfer rate of 12800Mbps, offering 60% higher bandwidth and 20% lower power consumption compared to LPDDR5X. CXMT stated that LPDDR6 will be used in phones, PCs, smart cars, edge servers, and more, representing a major milestone in its high-end memory development.

IT Home2026-09-07Chips & ComputeChinarel 35Read original ↗

Samsung Reportedly to Devote Half of Its 4nm Capacity to HBM4 Base Die Production

According to Korean media ZDNet Korea, Samsung Foundry is reserving significant capacity for HBM4 base die production, with about half of its 4nm process (SF4) capacity dedicated to this purpose. As customers demand custom logic integrated into the base die, Samsung's HBM market share reached 38% in Q2 2026, up from 15% a year earlier, while SK Hynix's share fell from 64% to 50%.

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Report: Chinese CMOS Maker OmniVision Surpasses Samsung in Global Share for First Time in 2025, Ranking Second Worldwide

Multiple research firms report that OmniVision surpassed Samsung in global CMOS image sensor (CIS) market share for the first time in 2025, becoming the world's second-largest supplier behind Sony. According to Techno Systems Research, the global CIS market was about $23 billion in 2025, with OmniVision's revenue around $3 billion, a 13% share. Nikkei BP also shows OmniVision second with 13.4%, Sony at 53.6%, and Samsung at 13.2%. OmniVision's growth is driven by automotive CIS, with revenue of 7.471 billion yuan, up 26.52% year-over-year, and over 30% global share in automotive CIS, ranking first.

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Report: 2026 Global and Computing Chip Industry Market Research

EE Times China published a market research report on the 2026 global and computing chip industry, covering market size, technology trends, and competitive landscape. The report notes that demand for computing chips continues to grow with the proliferation of AI applications, but specific figures are not disclosed in the excerpt.

Google News: AI泡沫2026-09-06Chips & ComputeGlobalrel 30Read original ↗

JPR: PC Market Weak in Q2 2026, Discrete GPU Shipments Grow 12.2% Against Trend

According to Jon Peddie Research, discrete GPU shipments grew 12.2% quarter-over-quarter and 14.1% year-over-year in Q2 2026, despite a weak PC market and memory shortages raising costs. Total consumer PC GPU shipments reached 75.5 million units, up 10.4% sequentially and 1.1% annually, driven mainly by laptops. Intel led with 56% market share, followed by Nvidia at 23% and AMD at 21%.

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Rayson Launches 96GB 9600MT/s LPDDR5X LPCAMM2 Memory Module

Rayson has launched a 96GB, 9600MT/s LPDDR5X LPCAMM2 memory module for high-performance AI PCs. Compared to traditional DDR5 SO-DIMM, it reduces board area by about 60%, power consumption by about 50%, and improves energy efficiency by about 70%, and has completed adaptation validation with leading international PC manufacturers.

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China is too short of computing power. Having its own AI chips will be extremely important! - Can Huawei catch up with Nvidia by 2030? Almost certainly not.

This article from Xueqiu discusses China's shortage of computing power and emphasizes the importance of self-developed AI chips. The author believes that Huawei's chance of catching up with Nvidia by 2030 is almost nil, reflecting China's challenges in the AI chip sector.

Google News: AI泡沫2026-09-05Chips & ComputeChinarel 30Read original ↗