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In Less Than Two and a Half Years: Intel Surpasses One Million High-NA EUV Wafers, Exceeding All Other Manufacturers Combined

Intel announced that it has processed over one million 300mm wafers using High-NA EUV lithography equipment, a milestone reached in less than two and a half years since its first tool was assembled. According to ASML, global High-NA EUV systems have processed over 500,000 wafers in total, with Intel alone exceeding the combined output of all other users. The technology is already used in production of Panther Lake processors, but faces reticle size limitations, prompting Intel to push for a larger 6x12 inch reticle standard.

IT Home2026-09-08Chips & ComputeUSrel 30Read original ↗

Micron Plans to Nearly Double HBM Capacity, HBM4 Targets Nvidia's Next-Gen Chips, Storage Sector Sees Rare Opportunity Amid AI Computing Wave

Micron Technology plans to significantly boost its High Bandwidth Memory (HBM) capacity, aiming to nearly double it, and will introduce HBM4 products to support Nvidia's next-generation AI chips. This move reflects the continued growth in AI computing demand, driving the storage sector's development.

Google News: AI泡沫2026-09-05Chips & ComputeUSrel 60Read original ↗

Broadcom Raises AI Chip Revenue Forecast to $115 Billion for 2027 as Meta, OpenAI and Anthropic Expand AI Infrastructure

Broadcom has significantly raised its AI semiconductor growth outlook as hyperscalers and leading AI companies accelerate investment in custom accelerators, networking chips and massive data-center infrastructure. Broadcom's Q2 fiscal 2026 results indicated that the company now expects AI chip revenue of about $115 billion in fiscal 2027, up from its previous forecast.

NewsData: AI bubble (EN)2026-09-03Chips & ComputeUSrel 85Read original ↗

Short-term Growth Fades, Long-term AI Compute Blueprint Stuns! Big Customers Ignite ASIC Supercycle, Broadcom (AVGO.US) Blasts Out $230 Billion AI Semiconductor Outlook

Broadcom provided a $230 billion AI semiconductor market outlook in its earnings report, despite short-term growth slowing, long-term AI compute demand is viewed positively. Big customers are driving an ASIC (application-specific integrated circuit) supercycle, expected to boost the company's performance.

Google News: AI泡沫2026-09-02Chips & ComputeUSrel 70Read original ↗

Broadcom raises AI chip forecast as Big Tech keeps writing bigger checks

Broadcom on Wednesday forecast strong AI chip sales for the next two years, offering fresh evidence that Big Tech's appetite for AI infrastructure remains undiminished as investors scrutinize returns on massive spending. Shares of the Palo Alto, California-based company were down over 1 per cent in extended trading.

NewsData: AI bubble (EN)2026-09-02Chips & ComputeUSrel 75Read original ↗

Google Dismantles Retired Servers for DDR4 Memory Modules, Redeploys Them in New AI Servers

According to IT Home on September 2, citing Wccftech, DRAM supply tightness is forcing AI service providers to take extraordinary measures. Google's senior director of supply chain infrastructure revealed that the AI industry has shifted from being 'compute-constrained' to 'memory-constrained', with high-performance memory accounting for about 75% of the bill of materials cost in a typical AI server. To break the bottleneck, Google is dismantling retired servers to recover DDR4 memory modules and using them in new AI servers via dedicated adapter cards, while also optimizing software to reduce memory overhead.

IT Home2026-09-02Chips & ComputeUSrel 55Read original ↗

Micron Explores Near-GPU NAND Flash to Support Larger AI Models

According to DigiTimes, Micron is researching high-endurance NAND flash modules to be placed closer to GPUs, offering a compromise between storage density and endurance. This 'near-GPU NAND' can handle non-low-latency/high-bandwidth workloads, allowing GPUs to directly access hundreds of GB of NAND storage pools, thereby supporting larger AI large language models.

IT Home2026-09-02Chips & ComputeUSrel 30Read original ↗

Qualcomm Details Next-Gen Adreno GPU: Matrix Cores Boost AI Compute, Could Improve Upscaling

Qualcomm has revealed details of its next-gen Adreno GPU, introducing Adreno matrix cores dedicated to on-device AI tasks with lower latency and power consumption. This design will power Adreno Neural Fusion, reducing visual artifacts and cutting power usage by up to 40%, while improving frame generation and upscaling. The new GPU runs at 1.45GHz, offers 12% better efficiency, and is supported by Unreal Engine and Unity.

IT Home2026-09-02Chips & ComputeUSrel 30Read original ↗

Qualcomm Launches Dragonwing Q-2390 and IQ-2390 Processors for Consumer IoT and More, Expected Early 2027

Qualcomm announced today the launch of the Dragonwing Q-2390 and IQ-2390 processors, targeting consumer IoT, industrial edge computing, and other areas. Both processors feature a quad-core Kryo CPU, Adreno704 GPU, and a real-time RISC-V MCU, supporting Linux, Android, and Zephyr OS. The Q-2390 targets commercial and consumer IoT, integrating on-device AI, camera and display support, and more; the IQ-2390 is an industrial edge AI processor supporting machine vision, AI acceleration, and other features, suitable for industrial automation, energy, and more. The products will be showcased at IFA 2026, with evaluation kits expected in early 2027.

IT Home2026-09-01Chips & ComputeUSrel 30Read original ↗